Intel® Celeron® Processor
Processor Number Speed (MHz) Boxed Test Specification (S-spec) OEM Test Specification (S-spec) Stepping CPUID L2 Cache Size Thermal Specification (°C) Thermal Design Power (W) Microcode Update Revision Notes
NA 1.10GHz SL5XR SL5XU cD0 068A 128k 77 33.0 01 3,4
NA 1.10A GHz SL5ZE SL5VQ tA1 06B1 256k 69 28.9 1C 3,5,6
SL6JR SL6CA tB1 06B4 256k 69 28.9 01 3,5,6,7
NA 1.20GHz SL5Y5 SL5XS tA1 06B1 256k 69 29.9 1C 3,5,6
SL68P SL656 tA1 06B1 256k 70 32.1 1C 3,5,6,7
SL6JS SL6C8 tB1 06B4 256k 70 32.1 01 3,5,6,7
NA 1.30GHz SL5ZJ SL5VR tA1 06B1 256k 71 33.4 1C 3,5,6,7
SL6JT SL6C7 tB1 06B4 256k 71 33.4 01 3,5,6,7
NA 1.40GHz SL68G SL64V tA1 06B1 256k 72 38.8 1C 3,5,6,7
SL6JU SL6C6 tB1 06B4 256k 72 38.8 01 3,5,6,7
NA 1.70GHz SL69Z SL68C E0 0F13 128k 76 63.5 05 3,8
NA 1.80GHz SL6A2 SL68D E0 0F13 128k 77 66.1 05 3,8
NA 1.80A GHz SL7RU SL7RU T0 0F29 128k 70 59.1 33 10,11
NA 2.00GHz SL6LC SL6HY C1 0F27 128k 68 52.8 37 3,8
NA 2.10GHz SL6SY SL6RS B1 0F27 128k 69 55.5 37 3,8,9
NA 2.20GHz SL6SX SL6RW B1 0F27 128k 70 57.1 37 3,8,9
NA 2.30GHz SL6T5 SL6** C1 0F27 128k 70 58.3 37 3,8,9
315 2.26GHz SL7XY SL7XY D0 0F34 256K 67 73 33 8,13
320 2.40GHz SL7KX SL7C4 D0 0F34 256k 67 73 33 8,13
NA 2.40GHz SL6XG SL6V2 C1 0F27 128k 71 59.8 37 3,8,9
NA 2.50GHz SL72B SL6ZZ D1 0F29 128k 72 61.0 17 3,8,9
325 2.53GHz SL7KY SL7C5 D0 0F34 256k 67 73 33 8,13
325J 2.53GHz SL7VR SL7VR E0 0F41 256K 67.7 84 09 10,11, 12,13
NA 2.60GHz SL6W5 SL6VV D1 0F29 128k 72 62.6 17 3,8,9
330 2.66GHz SL7KZ SL7C6 D0 0F34 256k 67 73 33 8,13
330J 2.66GHz SL7VS SL7VS E0 0F41 256K 67.7 84 09 10,11, 12,13
NA 2.70GHz SL77U SL77S D1 0F29 128k 74 66.8 17 3,8,9
335 2.80GHz SL7L2 SL7L2 D0 0F34 256K 67 73 33 8,13
335J 2.80GHz SL7VT SL7VT E0 0F41 256K 67.7 84 09 10,11, 12,13
NA 2.80GHz SL77V SL77T D1 0F29 128k 75 68.4 17 3,8,9
340 2.93GHz SL7RN SL7RN D0 0F34 256K 67 73 33 8,13
340J 2.93GHz SL7VU SL7VU E0 0F41 256K 67.7 84 09 10,11, 12,13
Notes:
1. This processor is in the S.E.P.P. form factor
2. This processor is in the PPGA form factor
3. This processor’s L2 cache has a 4GB address range and supports ECC, which cannot be disabled
4. This processor is in the FC-PGA form factor
5. This processor is in the 370-pin Flip Clip Pin Grid Array (FC-PGA2) package
6. This processor is a die shrink to 0.13mm process technology
7. This processor has a Vcc of 1.5 voltsv
8. This processor is in the 478-pin Flip Clip Pin Grid Array (FC-PGA2) package
9. This processor will ship under multiple VIDs of 1.475,1.500, and 1.525 with 1.525 being the max voltage. Thermal Specification (°C) is for the highest VID only
10. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate
11. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
12. This processor is in the 775-pin Flip Chip Land Grid Array (FC-LGA4) package
13. This processor is a die shrink to 90nm processor technology
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